Invention Grant
US08695427B2 Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure
有权
具有用于确定间隔层的层厚度的测试结构的微机械部件和用于制造这种测试结构的方法
- Patent Title: Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure
- Patent Title (中): 具有用于确定间隔层的层厚度的测试结构的微机械部件和用于制造这种测试结构的方法
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Application No.: US13116759Application Date: 2011-05-26
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Publication No.: US08695427B2Publication Date: 2014-04-15
- Inventor: Jochen Reinmuth , Ralf Boessendoerfer , Axel Franke , Mirko Hattass
- Applicant: Jochen Reinmuth , Ralf Boessendoerfer , Axel Franke , Mirko Hattass
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102010029645 20100602
- Main IPC: G01P15/125
- IPC: G01P15/125

Abstract:
A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.
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