Invention Grant
- Patent Title: Housing frame of electrical apparatus
- Patent Title (中): 电器外壳框架
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Application No.: US12883836Application Date: 2010-09-16
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Publication No.: US08695815B2Publication Date: 2014-04-15
- Inventor: Takehiro Takahashi , Yousuke Yamada
- Applicant: Takehiro Takahashi , Yousuke Yamada
- Applicant Address: JP Tokyo
- Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee: Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2009-219981 20090925
- Main IPC: A47F5/14
- IPC: A47F5/14 ; B25G3/00

Abstract:
A housing frame includes a first and second beams connected to each other through a connection member. The two beams are each obtained by perpendicularly bending a metal plate twice in the longitudinal direction. The second beam is arranged perpendicular to the first beam. The connection member has a connection base portion extending from a bent side surface of a second base portion to a bent side surface of a first base portion through a cut portion formed in a first side portion and overlaps with the first base portion and the second base portion. The connection base portion and the first base portion are fastened together by a first fastening member, and the connection base portion and the second base portion are fastened together by a second fastening member.
Public/Granted literature
- US20110074258A1 HOUSING FRAME OF ELECTRICAL APPARATUS Public/Granted day:2011-03-31
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