Invention Grant
- Patent Title: Semiconductor manufacturing process modules
- Patent Title (中): 半导体制造工艺模块
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Application No.: US11876902Application Date: 2007-10-23
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Publication No.: US08696298B2Publication Date: 2014-04-15
- Inventor: Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
- Applicant: Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: B65G49/07
- IPC: B65G49/07
Abstract:
A variety of process modules are described for use in semiconductor manufacturing processes.
Public/Granted literature
- US20080124194A1 SEMICONDUCTOR MANUFACTURING PROCESS MODULES Public/Granted day:2008-05-29
Information query
IPC分类:
