Invention Grant
- Patent Title: Waveform monitor apparatus of injection molding machine
- Patent Title (中): 注塑机波形监测仪
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Application No.: US13554259Application Date: 2012-07-20
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Publication No.: US08696342B2Publication Date: 2014-04-15
- Inventor: Nobukazu Kasuga , Hirofumi Murata , Takashi Hakoda , Osamu Ichikawa
- Applicant: Nobukazu Kasuga , Hirofumi Murata , Takashi Hakoda , Osamu Ichikawa
- Applicant Address: JP Nagano
- Assignee: Nissei Plastic Industrial Co., Ltd.
- Current Assignee: Nissei Plastic Industrial Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-160083 20110721
- Main IPC: B29C45/77
- IPC: B29C45/77 ; B29C45/78

Abstract:
When a waveform monitor apparatus 1 of an injection molding machine M for monitoring an operation waveform at least during molding is configured by mounting the waveform monitor apparatus 1 on the injection molding machine M for performing molding according to a specific molding system, a parting opening detecting means Fp for detecting change data of a parting opening Lm to a time during molding, and an operation waveform displaying means Fd for displaying at least change data from a resin filling start is into a mold 2 to a cooling time termination to of the mold 2, detected by the parting opening detecting means Fp, on a waveform displaying portion 5 of a screen 4v on a display 4 attached to a molding machine controller 3 are provided.
Public/Granted literature
- US20130022698A1 WAVEFORM MONITOR APPARATUS OF INJECTION MOLDING MACHINE Public/Granted day:2013-01-24
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