Invention Grant
- Patent Title: Conduit grounding clip
- Patent Title (中): 导管接地夹
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Application No.: US13419152Application Date: 2012-03-13
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Publication No.: US08696371B2Publication Date: 2014-04-15
- Inventor: Norman R. Byrne
- Applicant: Norman R. Byrne
- Agency: Varnum, Riddering, Schmidt & Howlett LLP
- Main IPC: H01R4/60
- IPC: H01R4/60

Abstract:
A wireless raceway (100) employs bus bars (121), instead of cabling or other types of wires. The raceway (100) includes a pair of junction blocks (102). A bus bar assembly (116) holds the individual bus bars (121). The raceway (100) also includes a pair of modified H-terminals (122) having a central bus bar terminal (124) connected to each of a pair of receptacle terminals (126). The modified H-terminals (122) connect the individual bus bars (121) to external electrical assemblies through the junction blocks (102) without the need of wires or cables.
Public/Granted literature
- US20120231645A1 CONDUIT GROUNDING CLIP Public/Granted day:2012-09-13
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