An electrical connector (100) for electrically connecting an IC package with a substrate includes a number of conductive contacts (4), a number of grounding terminals (5), an insulative member (32) made of insulation materials locates around the conductive contacts (4) with insert-molded method and an electrical member (1) made of electrical resin locates around the insulative member (32) and the grounding terminals (5) with insert-molded method, the conductive contacts (4) are insulated from the electrical member (1) and the grounding terminals (5) are electrically connected with the electrical member (1).