Invention Grant
- Patent Title: Systems for recycling slurry materials during polishing processes
- Patent Title (中): 在抛光过程中回收浆料的系统
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Application No.: US13333950Application Date: 2011-12-21
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Publication No.: US08696404B2Publication Date: 2014-04-15
- Inventor: Qi Sun , David Graves , John P. Sargent , Lindsey A. Hamilton
- Applicant: Qi Sun , David Graves , John P. Sargent , Lindsey A. Hamilton
- Applicant Address: US CA San Jose
- Assignee: WD Media, LLC
- Current Assignee: WD Media, LLC
- Current Assignee Address: US CA San Jose
- Main IPC: B24C9/00
- IPC: B24C9/00

Abstract:
Systems for recycling slurry materials during polishing processes are provided. One system includes a polisher having an inlet and drain outlet, and a slurry storage tank to supply a slurry including a preselected material to the polisher inlet, and a recycling assembly including a cross flow filter including an inlet to receive a waste slurry including the preselected material from the polisher drain outlet, where the cross flow filter is configured to concentrate the preselected material in an outlet slurry, a density meter configured to measure a concentration of the preselected material in the filter outlet slurry, a valve coupled to the filter outlet and configured to supply the slurry storage tank, and a controller coupled to the density meter and valve, where the controller is configured to open the valve when the concentration of the preselected material reaches a first concentration threshold.
Public/Granted literature
- US20130165029A1 SYSTEMS FOR RECYCLING SLURRY MATERIALS DURING POLISHING PROCESSES Public/Granted day:2013-06-27
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