Invention Grant
- Patent Title: Semiconductor manufacturing apparatus
- Patent Title (中): 半导体制造装置
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Application No.: US11571971Application Date: 2005-01-11
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Publication No.: US08696816B2Publication Date: 2014-04-15
- Inventor: Norifumi Tokuda , Yuuko Okada
- Applicant: Norifumi Tokuda , Yuuko Okada
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2005/000174 WO 20050111
- International Announcement: WO2006/075356 WO 20060720
- Main IPC: C23C16/00
- IPC: C23C16/00 ; B25B11/00
Abstract:
The present invention relates to a semiconductor manufacturing apparatus, and an object of the invention is to prevent breakage and deformation of semiconductor substrates without deteriorating operability in processing.In order to achieve the object, a semiconductor manufacturing apparatus has a stage (100) on which a semiconductor substrate (30) is placed, and the stage (100) has a first metal portion (10) that is made of metal and that comes in contact with the semiconductor substrate (30) placed thereon, and an electroconductive elastic-body portion (20) that is made of an electroconductive elastic body and that comes in contact with the semiconductor substrate (30) placed thereon. A contaminant (40) is embedded in the electroconductive elastic-body portion (20).
Public/Granted literature
- US20070228628A1 Semiconductor Manufacturing Apparatus Public/Granted day:2007-10-04
Information query
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