Invention Grant
- Patent Title: Lamination of polymer thick film conductor compositions
- Patent Title (中): 聚合物厚膜导体组合物的层压
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Application No.: US13648710Application Date: 2012-10-10
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Publication No.: US08696860B1Publication Date: 2014-04-15
- Inventor: Larry Alan Bidwell , Michael James Champ , John C. Crumpton , Jay Robert Dorfman
- Applicant: Larry Alan Bidwell , Michael James Champ , John C. Crumpton , Jay Robert Dorfman
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B7/12
- IPC: B32B7/12 ; H01B1/02 ; H01B1/22
Abstract:
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
Public/Granted literature
- US20140099499A1 LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS Public/Granted day:2014-04-10
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