A method of providing a fine line adhesive bond and/or seal or gasket and/or lined channel, and in particular a fine line bonding seal, between a first (14) and a second ply (16), especially of dissimilar materials, comprises the steps of: fabricating a microscale recess in at least a first ply; lidding the first ply with a second ply such that the recess or recesses in the ply or plies form a fluidly continuous channel (12), —urging curable material into this channel so as to substantially fill the channel with curable material, and in particular urging the material via an inlet (17) into a fluidly continuous channel until it emerges from an outlet (18) remote therefrom; curing the curable material in situ. A system for implementing the method and the bonded and/or sealed and/or lined product of such method are also described.