Invention Grant
US08697333B2 Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film
有权
可光固化树脂组合物，其干膜，图案形成方法和电气/电子部件保护膜
- Patent Title: Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective film
- Patent Title (中): 可光固化树脂组合物，其干膜，图案形成方法和电气/电子部件保护膜
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Application No.: US13271858Application Date: 2011-10-12
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Publication No.: US08697333B2Publication Date: 2014-04-15
- Inventor: Kyoko Soga , Takanobu Takeda , Hideto Kato
- Applicant: Kyoko Soga , Takanobu Takeda , Hideto Kato
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-230427 20101013
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03F7/00
Abstract:
A photocurable composition includes: (A) an epoxy group-containing polymer compound having repeating units represented by the following formula (1), where R1 to R4 are each a hydrocarbon group, m is an integer of 1 to 100, a, b, c and d are each 0 or a positive number, such that 0
Public/Granted literature
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