Invention Grant
- Patent Title: Radiation-sensitive resin composition and compound
- Patent Title (中): 辐射敏感性树脂组合物和化合物
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Application No.: US13351586Application Date: 2012-01-17
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Publication No.: US08697335B2Publication Date: 2014-04-15
- Inventor: Kazuo Nakahara , Mitsuo Sato
- Applicant: Kazuo Nakahara , Mitsuo Sato
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2009-168405 20090717
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; C07D211/44 ; H01L21/027

Abstract:
A radiation-sensitive resin composition includes a compound, a resin and a radiation-sensitive acid generator. The compound has a structure in which a group represented by a following formula (1) is bound to a nitrogen atom. The resin has an acid-dissociative dissolution-controlling group and has a property such that alkali solubility of the resin increases by an action of an acid. In the formula (1), Y is a monovalent group having 5 to 20 carbon atoms, and “*” represents a bonding hand with the nitrogen atom. In the formula (i), R1, R2 and R3 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms or a monovalent alicyclic hydrocarbon group having 4 to 12 carbon atoms, or R1 and R2 are linked with each other to form a bivalent alicyclic hydrocarbon group, and “*” represents a bonding hand with the oxygen atom.
Public/Granted literature
- US20120148952A1 RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND Public/Granted day:2012-06-14
Information query
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