MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.