Invention Grant
- Patent Title: Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate
- Patent Title (中): 配线基板中的电容器，电容器的制造方法以及布线基板
-
Application No.: US13610936Application Date: 2012-09-12
-
Publication No.: US08697534B2Publication Date: 2014-04-15
- Inventor: Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
- Applicant: Motohiko Sato , Kazuhiro Hayashi , Kenji Murakami , Motonobu Kurahashi , Yusuke Kaieda , Jun Otsuka , Manabu Sato
- Applicant Address: JP Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-370945 20051222; JP2005-370946 20051222; JP2005-370947 20051222
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.
Public/Granted literature
Information query
IPC分类:
