Invention Grant
US08697541B1 Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices 有权
制备单晶硅晶片的方法和结构,用作无裂纹氮化镓膜和器件的外延生长的基板

  • Patent Title: Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices
  • Patent Title (中): 制备单晶硅晶片的方法和结构,用作无裂纹氮化镓膜和器件的外延生长的基板
  • Application No.: US13337045
    Application Date: 2011-12-23
  • Publication No.: US08697541B1
    Publication Date: 2014-04-15
  • Inventor: Ananda H. Kumar
  • Applicant: Ananda H. Kumar
  • Agent Tue Nguyen
  • Main IPC: H01L21/30
  • IPC: H01L21/30 H01L21/46
Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices
Abstract:
This document describes the fabrication and use of ceramic stabilizing layer fabricated right on the product silicon wafer to facilitate its use as a substrate for fabrication of gallium nitride films. A ceramic layer is formed and then attached to a single crystal silicon substrate to form a composite silicon substrate that has coefficient of thermal expansion comparable with GaN. The composite silicon substrates prepared by this invention are uniquely suited for use as growth substrates for crack-free gallium nitride films, benefiting from compressive stresses produced by choosing a ceramic having a desired higher coefficient thermal expansion than those of silicon and gallium nitride.
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