Invention Grant
- Patent Title: Composition and method for polishing polysilicon
- Patent Title (中): 抛光多晶硅的组成和方法
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Application No.: US12971714Application Date: 2010-12-17
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Publication No.: US08697576B2Publication Date: 2014-04-15
- Inventor: Brian Reiss , Timothy Johns , Michael White , Lamon Jones , John Clark
- Applicant: Brian Reiss , Timothy Johns , Michael White , Lamon Jones , John Clark
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E Omholt; Francis J Koszyk; Steven D Weseman
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
The invention provides a polishing composition comprising silica, an aminophosphonic acid, a polysaccharide, a tetraalkylammonium salt, a bicarbonate salt, an azole ring, and water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Public/Granted literature
- US20110136344A1 COMPOSITION AND METHOD FOR POLISHING POLYSILICON Public/Granted day:2011-06-09
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