Invention Grant
- Patent Title: Temperature control method of heat processing plate, computer storage medium, and temperature control apparatus of heat processing plate
- Patent Title (中): 热处理板，计算机存储介质和加热板温度控制装置的温度控制方法
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Application No.: US13551307Application Date: 2012-07-17
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Publication No.: US08698052B2Publication Date: 2014-04-15
- Inventor: Masahide Tadokoro , Ryoichi Uemura , Mitsuteru Yano , Shinichi Shinozuka
- Applicant: Masahide Tadokoro , Ryoichi Uemura , Mitsuteru Yano , Shinichi Shinozuka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-143087 20060523
- Main IPC: H05B1/02
- IPC: H05B1/02
Abstract:
In the present invention, temperature drop amounts of heating plate regions when the substrate is mounted on a heating plate are detected to detect a warped state of the substrate. From the temperature drop amounts of the heating plate regions, correction values for set temperatures of the heating plate regions are calculated. The calculation of the correction values for the set temperatures of the heating plate regions is performed by estimating steady temperatures within the substrate to be heat-processed on the heating plate from the temperature drop amounts of the heating plate regions using a correlation obtained in advance. From the estimated steady temperatures within the substrate and the temperature drop amounts of the heating regions, the correction values for the set temperatures of the heating plate regions are calculated. Based on the correction values for the set temperatures, the set temperatures of the heating plate regions are changed.
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