Invention Grant
- Patent Title: Circuit board with thermo-conductive pillar
- Patent Title (中): 电路板带导热柱
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Application No.: US13186461Application Date: 2011-07-19
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Publication No.: US08698186B2Publication Date: 2014-04-15
- Inventor: Lac Nguyen , Chang Han
- Applicant: Lac Nguyen , Chang Han
- Applicant Address: US CA Fremont
- Assignee: Cofan USA, Inc.
- Current Assignee: Cofan USA, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Alston & Bird LLP
- Main IPC: H01L33/62
- IPC: H01L33/62
Abstract:
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
Public/Granted literature
- US20130020606A1 CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR Public/Granted day:2013-01-24
Information query
IPC分类:
