Invention Grant
- Patent Title: Lighting device and method for manufacturing the same
- Patent Title (中): 照明装置及其制造方法
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Application No.: US13490723Application Date: 2012-06-07
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Publication No.: US08698190B2Publication Date: 2014-04-15
- Inventor: Kohei Yokoyama , Hisao Ikeda , Shinichi Hirasa
- Applicant: Kohei Yokoyama , Hisao Ikeda , Shinichi Hirasa
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2011-129020 20110609
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
A lighting device is formed using a light-emitting element by a more simplified method. The lighting device includes a light-emitting element including a light-emitting layer between a first electrode and a second electrode, a substrate provided with the light-emitting element and an uneven region around the periphery of the light-emitting element, a sealing substrate facing the substrate, connection electrodes connected to the first electrode and the second electrode and formed over the uneven region, and a sealant for bonding the substrate and the sealing substrate. The connection electrodes are each formed using a conductive paste, and the sealant is in contact with the connection electrodes and the uneven region provided around the periphery of the light-emitting element.
Public/Granted literature
- US20120313128A1 Lighting Device and Method for Manufacturing the Same Public/Granted day:2012-12-13
Information query
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