Invention Grant
- Patent Title: CMOS semiconductor device and method for manufacturing the same
- Patent Title (中): CMOS半导体器件及其制造方法
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Application No.: US13567869Application Date: 2012-08-06
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Publication No.: US08698249B2Publication Date: 2014-04-15
- Inventor: Nobuyuki Mise , Takahisa Eimori
- Applicant: Nobuyuki Mise , Takahisa Eimori
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-312010 20071203
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A CMOS semiconductor device having an n-type MOSFET and a p-type MOSFET, comprising: a gate electrode of the n-type MOSFET having a first insulation layer composed of a high-k material, and a first metal layer provided on the first insulation layer and composed of a metal material; and a gate electrode of the p-type MOSFET having a second insulation layer composed of a high-k material, and a second metal layer provided on the second insulation layer and composed of a metal material, wherein the first insulation layer and the second insulation layer are composed of the different high-k materials, and the first metal layer and the second metal layer are composed of the same metal material.
Public/Granted literature
- US20130034953A1 CMOS SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-02-07
Information query
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