Invention Grant
- Patent Title: Wireless chip and manufacturing method of the same
- Patent Title (中): 无线芯片和制造方法相同
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Application No.: US11213997Application Date: 2005-08-30
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Publication No.: US08698262B2Publication Date: 2014-04-15
- Inventor: Takuya Tsurume , Koji Dairiki , Naoto Kusumoto
- Applicant: Takuya Tsurume , Koji Dairiki , Naoto Kusumoto
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-267415 20040914
- Main IPC: H01L21/14
- IPC: H01L21/14
Abstract:
The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
Public/Granted literature
- US20060055014A1 Wireless chip and manufacturing method of the same Public/Granted day:2006-03-16
Information query
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