Invention Grant
- Patent Title: Reverse recovery using oxygen-vacancy defects
- Patent Title (中): 使用氧空位缺陷进行反向恢复
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Application No.: US12967373Application Date: 2010-12-14
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Publication No.: US08698285B2Publication Date: 2014-04-15
- Inventor: Tadashi Misumi , Shinya Iwasaki , Takahide Sugiyama
- Applicant: Tadashi Misumi , Shinya Iwasaki , Takahide Sugiyama
- Applicant Address: JP Toyota-Shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- Priority: JP2009-285078 20091216; JP2010-169360 20100728
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device comprises a semiconductor substrate, a first electrode formed on a first main surface of the semiconductor substrate, and a second electrode formed on a second main surface of the semiconductor substrate. The semiconductor substrate includes a first region in which a density of oxygen-vacancy defects is greater than a density of vacancy cluster defects, and a second region in which the density of vacancy cluster defects is greater than the density of oxygen-vacancy defects.
Public/Granted literature
- US20110140243A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-06-16
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