Invention Grant
- Patent Title: Piezoelectric vibrating device capable of heat dissipation and conduction
- Patent Title (中): 压电振动器能够散热和传导
-
Application No.: US13233886Application Date: 2011-09-15
-
Publication No.: US08698379B2Publication Date: 2014-04-15
- Inventor: Wen-Tong Leu
- Applicant: Wen-Tong Leu
- Applicant Address: TW Taipei
- Assignee: Datron Products Co., Ltd.
- Current Assignee: Datron Products Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Meagher Emanuel Laks Goldberg & Liao, LLP
- Priority: TW100121855A 20110622
- Main IPC: H01L41/09
- IPC: H01L41/09

Abstract:
A piezoelectric vibrating device comprises a metallic containing member, a piezoelectric member and a heat dissipating and conducting member. The piezoelectric member is provided within the metallic containing member, and the heat dissipating and conducting member includes a plurality of the heat dissipating and conducting fins. Each the heat dissipating and conducting fin has a first heat conduction connecting end and a second heat conduction connecting end, wherein the first heat conduction connecting end is provided on an external surface of the piezoelectric member, and the second heat conduction connecting end is connected with an inner wall surface of the metallic containing member. The piezoelectric member generates vibrations with specific polarization directions based on a piezoelectric controlling signal, and the heat energy generated from the vibration of the piezoelectric member is conducted to the external wall surface of the metallic containing member through the heat dissipating and conducting member.
Public/Granted literature
- US20120326567A1 PIEZOELECTRIC VIBRATING DEVICE CAPABLE OF HEAT DISSIPATION AND CONDUCTION Public/Granted day:2012-12-27
Information query
IPC分类: