Invention Grant
- Patent Title: High power inductance device
- Patent Title (中): 大功率电感器件
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Application No.: US13395233Application Date: 2010-09-06
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Publication No.: US08698585B2Publication Date: 2014-04-15
- Inventor: Takashi Takiguchi , Yuko Kanazawa , Mikio Kitaoka , Satoshi Ota
- Applicant: Takashi Takiguchi , Yuko Kanazawa , Mikio Kitaoka , Satoshi Ota
- Applicant Address: JP Tokyo
- Assignee: FDK Corporation
- Current Assignee: FDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-211029 20090911
- International Application: PCT/JP2010/005455 WO 20100906
- International Announcement: WO2011/030531 WO 20110317
- Main IPC: H01F27/08
- IPC: H01F27/08

Abstract:
A high power inductance device enables a large ferrite magnetic core to be manufactured at low cost and with ease and improves heat radiation efficiency to reduce an increase in the temperature of the core. The inductance device has a ferrite magnetic core and a winding wire wound around the ferrite magnetic core and is mounted on a heat radiation structure through at least one of the front surfaces of the ferrite magnetic core. The ferrite magnetic core is made of a core aggregate obtained by arranging side by side a plurality of ferrite cores 10 having a completely-closed magnetic path structure or a quasi-closed magnetic path structure with a magnetic gap such that an interval is placed between the ferrite cores and magnetic paths are parallel to each other. The inductance device is mounted such that at least one plane surface of the peripheral surfaces of each of the ferrite cores is brought into direct or indirect contact with the heat radiation structure 18 with a metal plate 12 inserted into the interval between the ferrite cores and the common winding wire 14 wound around all the ferrite cores.
Public/Granted literature
- US20120169443A1 HIGH POWER INDUCTANCE DEVICE Public/Granted day:2012-07-05
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