Invention Grant
- Patent Title: Metamaterial antenna with mechanical connection
- Patent Title (中): 具有机械连接的超材料天线
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Application No.: US12604306Application Date: 2009-10-22
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Publication No.: US08698700B2Publication Date: 2014-04-15
- Inventor: Vaneet Pathak , Ajay Gummalla
- Applicant: Vaneet Pathak , Ajay Gummalla
- Applicant Address: CH
- Assignee: Tyco Electronics Services GmbH
- Current Assignee: Tyco Electronics Services GmbH
- Current Assignee Address: CH
- Main IPC: H01Q15/02
- IPC: H01Q15/02 ; H01Q1/50 ; H01Q1/24 ; H01Q1/38
Abstract:
Metamaterial antenna devices having one or more mechanical connection units made of electrically conductive materials to provide both mechanical engagement and electrical conduction for the antenna devices.
Public/Granted literature
- US20110095964A1 Metamaterial Antenna with Mechanical Connection Public/Granted day:2011-04-28
Information query
