A production method for a micromechanical component and a micromechanical component apparatus are provided encompassing the steps of: forming a housing having an incident light window, forming a multitude of optically active surfaces on a wafer, subdividing the wafer into a multitude of chips having at least one optically active surface in each case, which surface is designed in such a way that, at least in a deactivated operating mode of the chip, the optically active surface is situated in an initial position with respect to the chip, and affixing at least one of the chips inside the housing, the optically active surface of the chip in its initial position being aligned at an angle of inclination that is not equal to 0° and not equal to 180° with respect to the incident light window.