Invention Grant
- Patent Title: Electronic device, assembling method of electronic module and disassembling method of electronic module
- Patent Title (中): 电子设备，电子模块的组装方法和电子模块的拆卸方法
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Application No.: US13154451Application Date: 2011-06-07
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Publication No.: US08699219B2Publication Date: 2014-04-15
- Inventor: Hung-Chi Chen , Chia-Te Tsao , Chung-Kuo Lai , Ming-Chi Liu
- Applicant: Hung-Chi Chen , Chia-Te Tsao , Chung-Kuo Lai , Ming-Chi Liu
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW100111307A 20110331
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00
Abstract:
An electronic device is provided, which includes a bottom casing, an electronic module, at least a positioning part and an upper cover. The electronic module is disposed in the bottom casing. The positioning part is connected to the electronic module. The upper cover includes a cover body and a positioning portion. The cover body is assembled to the bottom casing. The positioning portion is connected to the cover body. A structural interference between the positioning portion and the positioning part makes the electronic module positioned. In addition, an assembling method of electronic module and a disassembling method of electronic module are also provided.
Public/Granted literature
- US20120250229A1 ELECTRONIC DEVICE, ASSEMBLING METHOD OF ELECTRONIC MODULE AND DISASSEMBLING METHOD OF ELECTRONIC MODULE Public/Granted day:2012-10-04
Information query
