Invention Grant
- Patent Title: Conductive buffer material and display device
- Patent Title (中): 导电缓冲材料和显示装置
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Application No.: US13258547Application Date: 2010-03-01
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Publication No.: US08699236B2Publication Date: 2014-04-15
- Inventor: Kohji Hisakawa , Hiroyuki Oonishi
- Applicant: Kohji Hisakawa , Hiroyuki Oonishi
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2009-091710 20090406
- International Application: PCT/JP2010/053206 WO 20100301
- International Announcement: WO2010/116817 WO 20101014
- Main IPC: H05K7/04
- IPC: H05K7/04 ; G02F1/1333

Abstract:
A conductive buffer material (11) is one surface of a display panel (29) sandwiched between a first member (BZ1) and a second member (CS), and is interposed between a first panel surface facing the metallic first member (BZ1) and the first member (BZ1). The conductive buffer material (11) includes an inclusion material (15) and a conductive envelope material (14) that wraps the inclusion material (15), and the conductive buffer material (11) includes a main portion in which part of the envelope material (14) is brought closer to the first panel surface and the first member (BZ1) by the inclusion material (15) having a given thickness or more.
Public/Granted literature
- US20120063113A1 CONDUCTIVE BUFFER MATERIAL AND DISPLAY DEVICE Public/Granted day:2012-03-15
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