Invention Grant
- Patent Title: Process poling for material configuration
- Patent Title (中): 材料配置的过程极化
-
Application No.: US13284164Application Date: 2011-10-28
-
Publication No.: US08699831B2Publication Date: 2014-04-15
- Inventor: Lars Helge Thylen , Michael Renne Ty Tan , Shih-Yuan Wang , Alexandre M Bratkovski , Wayne V Sorin , Michael Josef Stuke
- Applicant: Lars Helge Thylen , Michael Renne Ty Tan , Shih-Yuan Wang , Alexandre M Bratkovski , Wayne V Sorin , Michael Josef Stuke
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G02B6/12
- IPC: G02B6/12
Abstract:
A method includes fabricating a circuit element and a connection to the circuit element for a photonic integrated circuit. The method includes associating a configurable material with the circuit element and activating the configurable material via a poling rail and the connection to the circuit element during production of the integrated circuit.
Public/Granted literature
- US20130108207A1 PROCESS POLING FOR MATERIAL CONFIGURATION Public/Granted day:2013-05-02
Information query
