Invention Grant
- Patent Title: Semiconductor devices capable of dividing endpoint into majority of sub-endpoints
- Patent Title (中): 能够将端点划分为多数子端点的半导体器件
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Application No.: US12718138Application Date: 2010-03-05
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Publication No.: US08700810B2Publication Date: 2014-04-15
- Inventor: Sung Geun Park , Chul Joon Choi , Keon Han Sohn
- Applicant: Sung Geun Park , Chul Joon Choi , Keon Han Sohn
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Priority: KR10-2009-0018847 20090305
- Main IPC: G06F3/00
- IPC: G06F3/00
Abstract:
A semiconductor device includes at least one endpoint communicating with a host, and an endpoint controller dividing each of the at least one endpoint into a majority of sub-endpoints and performing numbering to each of the divided sub-endpoints. The endpoint controller transmits a packet generated by the host to any one of the sub-endpoints.
Public/Granted literature
- US20100228896A1 Semiconductor Devices Capable of Dividing Endpoint into Majority of Sub-Endpoints Public/Granted day:2010-09-09
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