Invention Grant
- Patent Title: Modular sensor node and communications system
- Patent Title (中): 模块化传感器节点和通信系统
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Application No.: US12469167Application Date: 2009-05-20
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Publication No.: US08700924B2Publication Date: 2014-04-15
- Inventor: Zahid F. Mian , Ryk E. Spoor , Bruce P. McKenney , Peter R. Hayes , Randy A. Leet
- Applicant: Zahid F. Mian , Ryk E. Spoor , Bruce P. McKenney , Peter R. Hayes , Randy A. Leet
- Applicant Address: US NY Troy
- Assignee: International Electronic Machines Corp.
- Current Assignee: International Electronic Machines Corp.
- Current Assignee Address: US NY Troy
- Agency: LaBatt, LLC
- Main IPC: G06F1/26
- IPC: G06F1/26

Abstract:
A sensor node for use in a sensor system includes a core component a sensor component and a power component. The core component includes processing and transmission/receiving components. Additionally, the core component includes interfaces for selectively connecting sensor and power components of any one of a plurality of types. In this manner, the core component enables the corresponding power and sensor components to be matched according to a particular application to generate the desired sensor node.
Public/Granted literature
- US20090300379A1 SENSOR SYSTEM Public/Granted day:2009-12-03
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