Invention Grant
- Patent Title: Interconnection device in a multi-layer shielding mesh
- Patent Title (中): 互连装置在多层屏蔽网中
-
Application No.: US13775049Application Date: 2013-02-22
-
Publication No.: US08701068B2Publication Date: 2014-04-15
- Inventor: Kenneth S. McElvain , William Halpin
- Applicant: Synopsys, Inc.
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Agent Judith A. Szepesi
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An integrated circuit (IC) comprising a shielding mesh in at least one layer of the IC, the shielding mesh having a first plurality of lines which are designed to provide a first reference voltage and having a second plurality of lines which are designed to provide a second reference voltage and wherein the shielding mesh comprises a window in which signal lines are routed with less shielding than signal lines which are routed in the shielding mesh. The IC further comprising power supply lines in at least a first layer of the IC, the first layer being different than the at least one layer which contains the shielding mesh, the power supply lines being coupled to the shielding mesh and being larger in width than the first plurality of lines and the second plurality of lines.
Public/Granted literature
- US20130162346A1 INTERCONNECTION DEVICE IN A MULTI-LAYER SHIELDING MESH Public/Granted day:2013-06-27
Information query