Invention Grant
- Patent Title: Group bounding box region-constrained placement for integrated circuit design
- Patent Title (中): 集成电路设计的边界区域约束布局
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Application No.: US13613678Application Date: 2012-09-13
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Publication No.: US08701070B2Publication Date: 2014-04-15
- Inventor: Yi-Lin Chuang , Chun-Cheng Ku , Yun-Han Lee , Shao-Yu Wang , Wei-Pin Changchien , Chin-Chou Liu
- Applicant: Yi-Lin Chuang , Chun-Cheng Ku , Yun-Han Lee , Shao-Yu Wang , Wei-Pin Changchien , Chin-Chou Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Among other things, one or more systems and techniques for defining a group bounding box for related cells of an integrated circuit, and generating a new layout for the integrated circuit comprising the group bounding box are provided herein. That is, one or more group bounding boxes are defined based upon positional values of related cells. Such group bounding boxes are placed within the new layout based upon a placement technique, such as an objective function that takes into account wire length, timing, and cell density, for example. The one or more group bounding boxes are sized or reshaped to reduce cell overlap within the new layout. In this way, the new layout comprises related cells, bound by one or more group bounding boxes, that are placed within the new layout according to a configuration that mitigates wire length and timing delay of the integrated circuit.
Public/Granted literature
- US20140075404A1 GROUP BOUNDING BOX REGION-CONSTRAINED PLACEMENT FOR INTEGRATED CIRCUIT DESIGN Public/Granted day:2014-03-13
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