Invention Grant
- Patent Title: Support structure and related assemblies and methods
- Patent Title (中): 支撑结构及相关装配及方法
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Application No.: US13105611Application Date: 2011-05-11
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Publication No.: US08701262B2Publication Date: 2014-04-22
- Inventor: Markus Hauf , Martin Latzel
- Applicant: Markus Hauf , Martin Latzel
- Applicant Address: DE Oberkochen
- Assignee: Carl Zeiss SMT GmbH
- Current Assignee: Carl Zeiss SMT GmbH
- Current Assignee Address: DE Oberkochen
- Agency: Fish & Richardson P.C.
- Priority: DE102010028942 20100512
- Main IPC: B23P11/02
- IPC: B23P11/02

Abstract:
A method is provided for producing a support structure including an at least partly reversibly deformable base body with a cut-out. A component can be held in the cut-out by friction. The method includes machining the base body in the braced state, wherein an opening is introduced into the base body and/or widened. The opening is deformed when the deformation force is removed such that the cut-out is formed. The opening is formed such that the application of a joining force makes it possible to deform the cut-out such that a component to be held can be introduced into the deformed cut-out with a clearance fit and an at least partial recovery of the deformed cut-out brings about a pressure contact between the held component and the cut-out in predefined circumferential regions. A method is disclosed for connecting a component to a support structure. A method is disclosed for connecting a component to an assembly including a support structure with a cut-out and a component.
Public/Granted literature
- US20110281043A1 SUPPORT STRUCTURE AND RELATED ASSEMBLIES AND METHODS Public/Granted day:2011-11-17
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