Invention Grant
- Patent Title: Method of manufactuing an electrical connector
- Patent Title (中): 制造电连接器的方法
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Application No.: US11888132Application Date: 2007-07-31
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Publication No.: US08701284B2Publication Date: 2014-04-22
- Inventor: Matthew Richard McAlonis , Jeffrey Joe Brown
- Applicant: Matthew Richard McAlonis , Jeffrey Joe Brown
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R43/20
- IPC: H01R43/20

Abstract:
A method of manufacturing an electrical connector comprises steps of providing a series of generic lead frames each having an array of contacts arranged in a common generic pattern, removing from one of the generic lead frames a first subset of the contacts to form a first pattern of contacts having a first spaced-apart relationship, removing from another of the generic lead frames a second subset of the contacts to form a second pattern of contacts having a different second spaced-apart relationship, wherein the first and second patterns are selectively obtained from the generic pattern, and loading the first and second patterns of contacts into a housing.
Public/Granted literature
- US20070270035A1 Modular connector assembly utilizing a generic lead frame Public/Granted day:2007-11-22
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