Invention Grant
- Patent Title: Sensor assembly with resilient contact portions
- Patent Title (中): 具有弹性接触部分的传感器组件
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Application No.: US13613040Application Date: 2012-09-13
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Publication No.: US08701476B2Publication Date: 2014-04-22
- Inventor: Leandro Westmann Prado , Ednei Lopes
- Applicant: Leandro Westmann Prado , Ednei Lopes
- Applicant Address: BR Sao Paulo
- Assignee: Tyco Electronics Brasil LTDA
- Current Assignee: Tyco Electronics Brasil LTDA
- Current Assignee Address: BR Sao Paulo
- Main IPC: G01M15/04
- IPC: G01M15/04

Abstract:
A sensor assembly for use in a vehicle. The sensor assembly has a housing for receiving a substrate. Terminals with substrate mating portions are provided in the housing. The substrate has components mounted thereon and plated openings which extend therethrough. The plated openings are provided in electrical engagement with the terminals. The openings are provided to mechanically and electrically engage the resilient contact portions of the terminals. The substrate mating portions are releasably pressure fit within the plated openings to allow the substrate to be removed and replaced as needed. The substrate mating portions maintain the electrical and mechanical connection between the substrate mating portions and the plated openings when the sensor assembly is exposed to vibration.
Public/Granted literature
- US20130068004A1 SENSOR ASSEMBLY WITH RESILIENT CONTACT PORTIONS Public/Granted day:2013-03-21
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