Invention Grant
- Patent Title: Sensor device
- Patent Title (中): 传感器装置
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Application No.: US13427076Application Date: 2012-03-22
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Publication No.: US08701485B2Publication Date: 2014-04-22
- Inventor: Masayuki Matsunaga
- Applicant: Masayuki Matsunaga
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2008-320185 20081216; JP2008-320186 20081216
- Main IPC: G01P1/02
- IPC: G01P1/02

Abstract:
A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; a resin part covering the sensor component; and mounting leads including a one-end part coupled to one first connection terminal in the resin part so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.
Public/Granted literature
- US20120180566A1 SENSOR DEVICE Public/Granted day:2012-07-19
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