Invention Grant
- Patent Title: Handheld stamp assembly
- Patent Title (中): 手持印章装配
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Application No.: US12550341Application Date: 2009-08-28
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Publication No.: US08701556B2Publication Date: 2014-04-22
- Inventor: Hsu-Shen Shih
- Applicant: Hsu-Shen Shih
- Applicant Address: TW Tainan
- Assignee: Sun Same Enterprises Co., Ltd.
- Current Assignee: Sun Same Enterprises Co., Ltd.
- Current Assignee Address: TW Tainan
- Agency: SU IP Consulting
- Main IPC: B41K1/42
- IPC: B41K1/42 ; B41K1/56

Abstract:
One embodiment of the present invention sets forth a handheld stamp assembly. The handheld stamp assembly includes a stamp mount having a top member with an opening and a bottom member capable of being slid into the top member along a first direction through the opening, wherein the top member and the bottom member form an enclosure when the top member slides into and is secured with the bottom member; and a handle coupled to the stamp mount in a detachable manner along a second direction.
Public/Granted literature
- US20110048258A1 HANDHELD STAMP ASSEMBLY Public/Granted day:2011-03-03
Information query
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