Invention Grant
US08701753B2 Method and apparatus for cooling a planar workpiece in an evacuated environment with dynamically moveable heat sinks
有权
在具有动态可移动散热器的抽真空环境中冷却平面工件的方法和装置
- Patent Title: Method and apparatus for cooling a planar workpiece in an evacuated environment with dynamically moveable heat sinks
- Patent Title (中): 在具有动态可移动散热器的抽真空环境中冷却平面工件的方法和装置
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Application No.: US10849848Application Date: 2004-05-21
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Publication No.: US08701753B2Publication Date: 2014-04-22
- Inventor: Chang Bok Yi , Tatsuru Tanaka , Paul Mcleaod
- Applicant: Chang Bok Yi , Tatsuru Tanaka , Paul Mcleaod
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Main IPC: F28F13/00
- IPC: F28F13/00 ; F28F13/08 ; F28F23/00
Abstract:
An apparatus and method for cooling a planar workpiece, such as a substrate of a recording disk, in an evacuated environment has a heat exchanging structure with at least two heat sinks having substantially parallel facing surfaces disposed within a vacuum chamber. A drive arrangement is connected to the heat sinks to controllably and dynamically drive the parallel facing surfaces of the heat sinks towards and away from each other.
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