Invention Grant
- Patent Title: Cover of a package, a method for manufacturing the same and a package sealed with a cover and a method for sealing a package
- Patent Title (中): 包装的盖，其制造方法和用盖密封的包装以及密封包装的方法
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Application No.: US12518844Application Date: 2007-12-05
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Publication No.: US08701922B2Publication Date: 2014-04-22
- Inventor: Päivi Määttä , Tapani Penttinen , Tommi Tuominen
- Applicant: Päivi Määttä , Tapani Penttinen , Tommi Tuominen
- Applicant Address: FI Helsinki
- Assignee: Stora Enso OYJ
- Current Assignee: Stora Enso OYJ
- Current Assignee Address: FI Helsinki
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: FI20065795 20061212; FI20070204 20070514
- International Application: PCT/FI2007/050664 WO 20071205
- International Announcement: WO2008/071838 WO 20080619
- Main IPC: B65D41/00
- IPC: B65D41/00
Abstract:
A cardboard cover that seals a package and that also enables the resealing of the package. The lower surface of the cover (2) is provided with a downwards directed annular profile (3) made of an injection mouldable material, which enables the resealing of the cover and is placed inside the package when the package is sealed. The invention also relates to a package which is sealed by using the above-described cardboard cover that enables resealing. The invention also relates to a method for manufacturing a card-board cover and a method for sealing a package.
Public/Granted literature
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