Invention Grant
- Patent Title: Induction bonding
- Patent Title (中): 感应焊接
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Application No.: US13749645Application Date: 2013-01-24
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Publication No.: US08701966B2Publication Date: 2014-04-22
- Inventor: Michael Nikkhoo , Amir Salehi
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: B23K37/04
- IPC: B23K37/04 ; B23K13/01
Abstract:
The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
Public/Granted literature
- US20130186941A1 INDUCTION BONDING Public/Granted day:2013-07-25
Information query
IPC分类:
