Invention Grant
- Patent Title: Printed board and bus bar assembly
- Patent Title (中): 印刷板和母线组件
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Application No.: US13313293Application Date: 2011-12-07
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Publication No.: US08701971B2Publication Date: 2014-04-22
- Inventor: Masahiro Tagano , Teruyuki Kitahara
- Applicant: Masahiro Tagano , Teruyuki Kitahara
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Oliff PLC
- Priority: JP2006-270550 20061002
- Main IPC: B23K1/20
- IPC: B23K1/20 ; H01R9/22 ; H05K1/11

Abstract:
A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.
Public/Granted literature
- US20120074208A1 PRINTED BOARD AND BUS BAR ASSEMBLY Public/Granted day:2012-03-29
Information query
IPC分类: