Invention Grant
- Patent Title: Film forming apparatus and film forming method
- Patent Title (中): 成膜装置及成膜方法
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Application No.: US12681464Application Date: 2008-09-29
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Publication No.: US08702913B2Publication Date: 2014-04-22
- Inventor: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
- Applicant: Kenichi Imakita , Tadashi Morita , Hiroki Yamamoto , Naoki Morimoto , Ayao Nabeya , Shinya Nakamura
- Applicant Address: JP Kanagawa
- Assignee: Ulvac, Inc.
- Current Assignee: Ulvac, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Christensen Fonder P.A.
- Priority: JP2007-261286 20071004
- International Application: PCT/JP2008/067660 WO 20080929
- International Announcement: WO2009/044705 WO 20090409
- Main IPC: C23C14/34
- IPC: C23C14/34
Abstract:
A film formation apparatus and film formation method that improve film thickness uniformity. A rotation mechanism holds a target having a sputtered surface in a state inclined relative to a surface of a substrate. The rotation mechanism rotatably supports the target about an axis extending along a normal of the sputtered surface. The target supported by the rotation mechanism is sputtered to form a thin film on the surface of the substrate. When forming the thin film, the rotation mechanism maintains the rotational angle of the target.
Public/Granted literature
- US20100236918A1 FILM FORMING APPARATUS AND FILM FORMING METHOD Public/Granted day:2010-09-23
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