Invention Grant
- Patent Title: Click plywood flooring
- Patent Title (中): 点击胶合板地板
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Application No.: US13061672Application Date: 2009-03-09
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Publication No.: US08703299B2Publication Date: 2014-04-22
- Inventor: Sung-Ha Park , Jae-Wan Sung
- Applicant: Sung-Ha Park , Jae-Wan Sung
- Applicant Address: KR Seoul
- Assignee: LG Hausys, Ltd.
- Current Assignee: LG Hausys, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2008-0086600 20080903
- International Application: PCT/KR2009/001149 WO 20090309
- International Announcement: WO2010/027133 WO 20100311
- Main IPC: B32B21/08
- IPC: B32B21/08
Abstract:
A plywood flooring including a plywood as a substrate, where the plywood is heat-compressive treated in a density of 0.6 to 1.0 g/cm3 and is impregnated with a synthetic resin having a viscosity of 100 to 20,000 cp, which has both of the advantages of reinforced floorboards and the advantages of plywood floorboards.
Public/Granted literature
- US20110162308A1 CLICK PLYWOOD FLOORING Public/Granted day:2011-07-07
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