Invention Grant
- Patent Title: Positive photosensitive resin composition
- Patent Title (中): 正型感光性树脂组合物
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Application No.: US13073005Application Date: 2011-03-28
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Publication No.: US08703367B2Publication Date: 2014-04-22
- Inventor: Hyun-Yong Cho , Doo-Young Jung , Yong-Sik Yoo , Ji-Young Jeong , Jong-Hwa Lee , Min-Kook Chung , Kil-Sung Lee , Myoung-Hwan Cha
- Applicant: Hyun-Yong Cho , Doo-Young Jung , Yong-Sik Yoo , Ji-Young Jeong , Jong-Hwa Lee , Min-Kook Chung , Kil-Sung Lee , Myoung-Hwan Cha
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins, Pendleton & Ashe, P.A.
- Priority: KR10-2008-0095569 20080929
- Main IPC: G03F7/023
- IPC: G03F7/023 ; G03F7/022

Abstract:
A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes.
Public/Granted literature
- US20110171578A1 Positive Photosensitive Resin Composition Public/Granted day:2011-07-14
Information query
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