Invention Grant
US08703367B2 Positive photosensitive resin composition 有权
正型感光性树脂组合物

Positive photosensitive resin composition
Abstract:
A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes.
Public/Granted literature
Information query
Patent Agency Ranking
0/0