Invention Grant
- Patent Title: Substrate treatment method, coating treatment apparatus, and substrate treatment system
- Patent Title (中): 基板处理方法,涂布处理装置和基板处理系统
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Application No.: US13041935Application Date: 2011-03-07
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Publication No.: US08703400B2Publication Date: 2014-04-22
- Inventor: Kenji Tsutsumi , Junichi Kitano , Osamu Miyahara , Hideharu Kyouda
- Applicant: Kenji Tsutsumi , Junichi Kitano , Osamu Miyahara , Hideharu Kyouda
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-011243 20070122
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.
Public/Granted literature
- US20110155693A1 SUBSTRATE TREATMENT METHOD, COATING TREATMENT APPARATUS, AND SUBSTRATE TREATMENT SYSTEM Public/Granted day:2011-06-30
Information query
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