Invention Grant
- Patent Title: Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof
- Patent Title (中): 发光装置的制造方法,发光装置及其安装基座
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Application No.: US14017056Application Date: 2013-09-03
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Publication No.: US08703513B2Publication Date: 2014-04-22
- Inventor: Takaaki Sakai , Shinichi Katano
- Applicant: Stanley Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2009-147905 20090622
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A metal plate is prepared, on which at least one joint slit made up of a joint and an opening is formed in a predetermined direction for integrating multiple mounting plates of the light emitting apparatuses. Multiple light emitting elements set in array are mounted on the metal plate. An aperture is provided at a position corresponding to a position for mounting the light emitting element on the metal plate, and a plate-like reflector made of resin, on which a first reflector splitting groove is formed at a position coinciding with the joint slit of the metal plate, is mounted and fixed on the metal plate in such a manner as superimposed thereon. The metal plate and the resinous reflector are superimposed one on another and broken together, whereby the metal plate can be split successfully.
Public/Granted literature
- US20140004634A1 METHOD FOR MANUFACTURING LIGHT EMITTING APPARATUS, LIGHT EMITTING APPARATUS, AND MOUNTING BASE THEREOF Public/Granted day:2014-01-02
Information query
IPC分类: