Invention Grant
- Patent Title: MEMS substrates, devices, and methods of manufacture thereof
- Patent Title (中): MEMS基板，装置及其制造方法
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Application No.: US12173537Application Date: 2008-07-15
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Publication No.: US08703516B2Publication Date: 2014-04-22
- Inventor: Florian Schoen
- Applicant: Florian Schoen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Micro-electromechanical system (MEMS) substrates, devices, and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a workpiece having an isolation ring in a top portion thereof, and a moveable element disposed within the isolation ring.
Public/Granted literature
- US20100013031A1 MEMS Substrates, Devices, and Methods of Manufacture Thereof Public/Granted day:2010-01-21
Information query
IPC分类:
