Invention Grant
- Patent Title: Semiconductor package and method for manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13339100Application Date: 2011-12-28
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Publication No.: US08703533B2Publication Date: 2014-04-22
- Inventor: Si Han Kim
- Applicant: Si Han Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2011-0013242 20110215
- Main IPC: H01L21/50
- IPC: H01L21/50
Abstract:
A semiconductor package includes a substrate having a connection terminal with a groove on its surface. Nanopowder may be disposed on a bottom of the groove. A semiconductor chip may be flip-chip bonded to the substrate by the nanopowder. A filler member may be interposed between the substrate and the semiconductor chip.
Public/Granted literature
- US20120205796A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-08-16
Information query
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