Invention Grant
- Patent Title: Inductors occupying space above circuit board components
- Patent Title (中): 电感器占用电路板部件以上的空间
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Application No.: US13079281Application Date: 2011-04-04
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Publication No.: US08704108B2Publication Date: 2014-04-22
- Inventor: Todd Martin Schaible , Neil Bryan Adams , Matthew David Kretman
- Applicant: Todd Martin Schaible , Neil Bryan Adams , Matthew David Kretman
- Applicant Address: HK Kwon Tong, Kowloon
- Assignee: Astec International Limited
- Current Assignee: Astec International Limited
- Current Assignee Address: HK Kwon Tong, Kowloon
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
Methods of making an assembly are disclosed. The assembly may include a circuit board with a top surface and a circuit component mounted on the top surface of the circuit board. The method may include positioning an inductor coil above the circuit component and the top surface of the circuit board and encapsulating the inductor coil, the circuit component and at least part of the top surface of the circuit board in a magnetic material. Assemblies according to such methods are also disclosed.
Public/Granted literature
- US20110242775A1 Inductors Occupying Space Above Circuit Board Components Public/Granted day:2011-10-06
Information query
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